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Total investment of 3.5 billion!

Set R&D design, intelligent production, high efficiency and energy saving, etc.

elements including high-end packaging and loading board mass production

"Intelligent Factory" - Yuexin Semiconductor Project

Once again, the latest progress!

Recently, the

The B1 plant of Yuexin project officially started the installation.

This marks the "fast track" of the project.

After full completion and production

will accelerate the realization of China's urgent need for "domestic substitution" in the field of sealing and loading board.

The urgent need of "domestic replacement"!

In the B1 clean room of Yuexin Semiconductor's high-end RF and FCBGA package board production and manufacturing project (hereinafter referred to as "Yuexin Semiconductor Project"), high speed drilling machines imported from Germany are neatly arranged and many technicians are methodically debugging the equipment.

The construction report card of Yuexin Semiconductor Project is very bright, as it achieved the "land acquisition and construction" in 16 days, the first plant topping out in 50 days and the second plant topping out in 90 days. Recently, Yuexin Semiconductor Project ushered in another important milestone, the first phase of the main plant of the project started equipment installation and entered the installation and debugging stage, which marked that Yuexin Semiconductor Project embarked on the "fast track" of continuous development and growth.

Ltd. (hereinafter referred to as "Yueya Semiconductor") invested 3.5 billion RMB in the construction of Yuexin Semiconductor Project. At present, the main building of the first phase of the project has been topped out, according to the plan, it will be fully completed and reach production by the end of 2024, and the annual output value is expected to reach 3.5 billion yuan.

▲Zhuhai Yueya Semiconductor Co.

Xiaodou learned that the project will build an intelligent factory for mass production of high-end packaging and loading boards, including R&D and design, intelligent production, high efficiency and energy saving. At that time, Yueya Semiconductor will further promote the intelligent change of domestic IC packaging and loading board industry.

As we all know, with the popularity of 5G, RF products are being used in a wide range of fields and are facing the urgent need for change in terms of complexity, design, process and materials.

As one of the first companies in China to achieve mass production of "coreless" packaging boards by using the "copper pillar layer method", Echosemi, which started from the R&D of RF products, can best meet the needs of today's advanced packaging design with high density, low power consumption and high speed.

In addition, Yueya Semiconductor has also independently developed and mastered 5 major patented core technologies, such as "Via-post copper pillar method", "Coreless encapsulation board" and "Active-passive device embedded package". The company has participated in the development of two national standard plans. According to statistics, as of July this year, Yueya Semiconductor has 195 authorized core technology patents, covering the United States, South Korea, Japan, Israel and other countries.

▲Nantong Yueya

The excellent product quality and advanced technology advantages have also earned Yueya Semiconductor an excellent global ranking. XiaoDou learned that with 16 years of deep cultivation in the semiconductor device and package loading board industry, Yueya Semiconductor has become a major IC package loading board, semiconductor device and semiconductor module R&D and manufacturing company in China, which is projected to account for about 35% of the global and 85% of the domestic market share in the segment. They are also one of the first companies in China to use embedded technology to achieve mass production of power management chip package boards.

It is worth mentioning that Yueya Semiconductor is also one of the first domestic manufacturers to mass produce FCBGA package boards. The FCBGA package load board will also be one of the main products produced by Yuexin Semiconductor project.

Small bucket learned that the current FCBGA carrier board is basically in the market situation monopolized by overseas manufacturers, the global production capacity is mainly in the hands of Japan, South Korea and other countries, there are technical weaknesses in the domestic production capacity in a state of shortage.

In order to continue to meet the incremental demand for FCBGA products at home and abroad, as early as 2012, Yueya Semiconductor began to layout the technology development and key equipment investment for FCBGA carrier boards, and the Yuexin Semiconductor project was thus born.

Enhance product self-sufficiency

Accelerate the expansion of industrial space

Create an industry benchmark for intellectual manufacturing

To fully implement "Industry First" in Doumen

Add energy to build up momentum!

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